Semiconductor Wafer Thickness & Precision Step Height Analysis
Micro Precision uses state of the art technology to perform semiconductor wafer thickness and step height analysis by incorporating accredited ellipsometry and surface profiling methodologies. Our laboratory in Richardson, TX is accredited by ANAB to perform ISO/IEC 17025-2017 accredited measurements.
Wafer thickness and step height analysis are critical components used in the semiconductor industry.
What is an ellipsometer?
The VASE® variable angle spectroscopic ellipsometer features computer-controlled wavelength and angle of incidence selection. A Xenon lamp supplies light from the ultraviolet (UV) to the near infrared (NIR). Individual wavelengths are selected with a double-chamber monochromator. A stacked Si/InGaAs detector is used from 193nm to 1700nm. Recent development of an extended InGaAs detector allows measurement to 2500nm. The VASE® uses a rotating analyzer ellipsometer (RAE) configuration with the addition of JJ Woolam’s patented AutoRetarder™
Defining Ellipsometry:
Ellipsometry is the use of polarized light to characterize thin film and bulk materials. A change in polarization is measured after reflecting light from the surface. Thin film thickness (t) and optical constants (n, k) are derived from the measurement.
Information is obtained from each layer interacting with the measurement. Light returning from the film–substrate interface interferes with the surface reflection to provide layer information.
Accredited Step Height Analysis Capabilities
Stylus profilers and surface standards:
Stylus profilers are versatile measurement tools for the study of surface topography. The profiler relies on a small-diameter metal stylus with a diamond or composite material tip that scans the surface of the sample. During the scan, the stylus makes direct contact with the surface to obtain data with very high precision and repeatability. The stylus profiler stage moves the sample linearly under the stylus to obtain measurements of the surface profile. As it encounters surface features, the stylus moves vertically to measure the various features.
New advances in stylus profiler technology have been developed for shrinking geometries. They include a Low Inertia Sensor for unparalleled step height repeatability. Incorporation of software enhancements and program leveling functions ensure consistent accurate measurement with minimal uncertainty.
Precision step height calibration:
Measurement capability is set up with the use of a surface profile system, which in conjunction with NIST referenced and traceable standards are used to measure overall step height profile.
Dektak 3®
Surface profiler with 6.5″ sample vacuum stage, 3″x6″ XY sample translation, manual stage, 1A vertical resolution, 131um maximum vertical range, 50um to 50mm scan length, maximum 8,000 points per scan, 1mg-40mg programmable stylus force range.
Semiconductor Wafer & Step Height Capabilities
ANAB Accredited to ISO/IEC 17025-2017 Accredited capability:
- Semiconductor Wafer Thickness Standards
- Semiconductor Precision Step Height
| Parameter / Equipment | Range | Expanded Uncertainty of Measurement (+/-) | Accredited (ISO/IEC 17025, Z540.3) |
|---|---|---|---|
| Wafer Thickness | (3.0 to 1500)nm | 0.32nm | Ellipsometer and Standard Wafers |
| Precision Step Height Standards | (100 to 1000)A (>1 to 250)kA | 17A | Surface Profiler and Standard Step |
Other Capabilities
Micro Precision can perform instrument calibration services on equipment from variety of applications for specific industries and lines of business. If you have a calibration need that is not listed in this area, please contact us.
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